IMPROVING BATWING POWER DISSIPATION

内容简介

Allegro MicroSystems’ stepper motor ICs are
power ICs encapsulated in DIP (dual in-line), SOIC
(small outline integrated circuit), and PLCC (plastic
leaded chip carrier) packages. The silicon die is
directly bonded to a heat-spreading lead frame
(batwing) for efficient heat transfer to an external heat
sink, or to a copper ground plane on the printed
wiring board.

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