凯悌集团推出的电视机 ( TV ) 之主、被动元件最佳解决方案详解 (3)

      功率电感：

Winbond (华邦电子)提供SPI之最佳 Memory解决方案：

　　Winbond Specialty DRAM Strategy

　　Focus on Non-PC Main Memory

　　_ Winbond runs “zero” PC main DRAM Biz with Winbond Branded products
　　_ Over 75% of W/W DRAM demand is from PC main memory
　　_ Long-term support with stable supply and the most advance technology
　　_ Complete Specialty DRAM Solution Provider
　　_ Density : 16~256M SDR, 64~256M DDR, 128M~1G DDR2
　　_ Speed : Up to 200MHz for SDR, 250MHz for DDR1, 533MHz for DDR2
　　_ I-temp Support with all 90nm SDR/DDR products
　　_ x16 / x32 ; 1.8V support for SDR/DDR
　　_ Support BGA (60/90/144 ball) Package
　　_ Support KGD business with RDL solution
　　_ (Many Successful Stories)
　　_ To Expand Market Share of Specialty DRAM aggressively

　　Winbond Flash Memory Strategy
　　Winbond is well positioned for Serial Flash Market growth
　　Primary focus and market advantage is Serial Flash
　　Wide range of SpiFlash® Memories (1Mb to 128Mb)
　　Superior features, Industry’s highest performance
　　First to introduce Dual and Quad Serial Flash
　　Complimentary Parallel Flash Memories
　　Spansion compatible (16Mb to 32Mb)
　　Strong Manufacturing Resources
　　Competitive cost, new 90nm Technology
　　In-house test, Known Good Die (KGD) capability
　　Ample wafer capacity

　　SpiFlash® W25Q Quad-SPI Family
　　Next Generation Serial Flash
　　Introduced in Aug 2007
　　Worlds First Quad SPI Serial Flash
　　25Q16 and 25Q32 in 130nm technology
　　SPI, Dual-SPI and Quad-SPI
　　Uniform 4KB, 32KB & 64KB erase
　　Industry’s Highest Performance
　　80MHz clock, 320MHz equiv. with Quad-SPI (40MB/S)
　　>6X the performance of most Serial Flash,
　　Execute code from SPI (XIP) or Faster Boot-up (Code Shadow)
　　Security and other Features
　　Lock-down & OTP write protect, 64-bit ID# (special order)
　　Erase suspend/resume, Quad ProgrammingB

　　New SpiFlash® W25Q “B” Series
　　Winbond’s next generation SpiFlash family
　　W25Q16B and W25Q64B are first in a family of 1M to 128M-bit
　　Single, Dual and Quad SPI interface in one device
　　Advanced 90nm Winbond Technology and Features
　　First Serial Flash supplier with 90nm from 12” fab
　　Packaging: First 64M-bit to fit in low-cost 8-pin SO package
　　Performance: 104MHz Quad-SPI is industry highest
　　Programming: 100% faster (reduces customer test time and application updates)
　　Voltage Options: 3.3V, 2.5V and 1.8V operation
　　New Features: Erase/Write-Suspend/Resume, OTP Security, Burst-with-Wrap
　　Compatibility: Use for existing SPI, as well as new Dual and Quad SPI designs
　　W19B Parallel Flash Family
　　16Mb & 32Mb Densities
　　2.7~3.6 Volt, x8/x16
　　70 ns Access Time
　　Single Bank Architecture
　　Top or Bottom Boot Block
　　48-Pin TSOP (12x20mm) Package
　　Compatible with:
　　Spansion-29 series
　　MXIC-29 series
　　STM-29 series
　　Atmel-49 series
　　SST-39 series