ST 公司的LSM320HAY30是低功耗系统级封装的 3D数字线性加速度传感器,用户动态可选择的满量程为±2g/±4 g/±8g,角速率±300 dps,输出数据速率从0.5Hz 到高达1 kHz.工作电压2.7V到3.6V, I2C/SPI接口,6D取向选择,主要用在智能用户接口的运动控制,显示器取向,工业控制和机器人,游戏机,以及自由跌落检测.本文介绍LSM320HAY30主要特性,方框图以及电连接框图和外接元件数值表.
The LSM320HAY30 is a low-power system-in-package featuring a 3D digital linear acceleration sensor and a 2D analog angular rate pitch and yaw sensor. It provides excellent temperature stability and high resolution over an extended operating temperature range (-40℃to +85℃).
ST’s family of sensor modules leverages the robust and mature manufacturing process already used for the production of micromachined accelerometers. The LSM320HAY30 has a dynamically user-selectable full-scale acceleration range of ±2 g/±4 g/±8 g, and an angular rate of ±300 dps capable of detecting rates with a -3 dB bandwidth up to 140 Hz along pitch and yaw axes. The LSM320HAY30 is capable of measuring linear accelerations with output data rates from 0.5 Hz up to 1 kHz. The embedded self-test capability allows the user to check the functioning of each sensor in the final application. The device can be configured to generate an interrupt signal by inertial wakeup/free-fall events as well as by the position of the device itself. Several years ago ST successfully pioneered the use of this package for accelerometers. Today, ST has the widest manufacturing capability and strongest expertise in the world for production of sensors in plastic LGA packages.
■ 2.7 V to 3.6 V power supply operation
■ Low voltage compatible digital IOs, 1.8 V
■ ±2 g/±4 g/±8 g dynamically selectable full-scale
■ ±300 dps absolute analog angular rate output
■ I2C/SPI digital linear acceleration interface (16 bit data output)
■ Two separated outputs for pitch and yaw axis (1x and 4x amplified)
■ Integrated low-pass filters for angular rate
■ 2 independent programmable interrupt generators for free-fall and motion detection
■ Sleep-to-wakeup function
■ 6D orientation detection
■ Extended operating temperature range (40℃ to +85℃)
■ High stability over temperature
■ High shock survivability
■ Embedded self-test
■ Embedded power-down
■ Embedded low-power mode
■ ECOPACK® RoHS and “Green” compliant
■ Motion control for smart user interface
■ Display orientation
■ Gaming and virtual reality input devices
■ Industrial and robotics
■ Vibration monitoring and compensation
■ Impact recognition and logging
■ Motion-activated functions
■ Intelligent power-saving for handheld devices
■ Free-fall detection
The device core is supplied through the Vdd line. Power supply decoupling capacitors
(C1=100 nF ceramic, C2=10 μF aluminum) should be placed as near as possible to the
supply pin of the device (common design practice).